wafer bottom-oxide etching
- wafer bottom-oxide etching
- plokštelės apačios oksido ėsdinimas
statusas T sritis radioelektronika
atitikmenys: angl. wafer bottom-oxide etching
vok. Ätzen der oxydierten Waferrückseite, n
rus. травление оксидированной обратной поверхности пластины, n
pranc. décapage de surface inverse oxydée de tranche, m
Radioelektronikos terminų žodynas. – Vilnius : BĮ UAB „Litimo“.
Kazimieras Gaivenis, Gytis Juška, Vidas Kalesinskas.
2000.
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décapage de surface inverse oxydée de tranche — plokštelės apačios oksido ėsdinimas statusas T sritis radioelektronika atitikmenys: angl. wafer bottom oxide etching vok. Ätzen der oxydierten Waferrückseite, n rus. травление оксидированной обратной поверхности пластины, n pranc. décapage de… … Radioelektronikos terminų žodynas
plokštelės apačios oksido ėsdinimas — statusas T sritis radioelektronika atitikmenys: angl. wafer bottom oxide etching vok. Ätzen der oxydierten Waferrückseite, n rus. травление оксидированной обратной поверхности пластины, n pranc. décapage de surface inverse oxydée de tranche, m … Radioelektronikos terminų žodynas
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травление оксидированной обратной поверхности пластины — plokštelės apačios oksido ėsdinimas statusas T sritis radioelektronika atitikmenys: angl. wafer bottom oxide etching vok. Ätzen der oxydierten Waferrückseite, n rus. травление оксидированной обратной поверхности пластины, n pranc. décapage de… … Radioelektronikos terminų žodynas
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